Capillary interconnect device

ABSTRACT

A manifold for connecting external capillaries to the inlet and/or outlet ports of a microfluidic device for high pressure applications is provided. The fluid connector for coupling at least one fluid conduit to a corresponding port of a substrate that includes: (i) a manifold comprising one or more channels extending therethrough wherein each channel is at least partially threaded, (ii) one or more threaded ferrules each defining a bore extending therethrough with each ferrule supporting a fluid conduit wherein each ferrule is threaded into a channel of the manifold, (iii) a substrate having one or more ports on its upper surface wherein the substrate is positioned below the manifold so that the one or more ports is aligned with the one or more channels of the manifold, and (iv) means for applying an axial compressive force to the substrate to couple the one or more ports of the substrate to a corresponding proximal end of a fluid conduit.

This invention was made with Government support under Contract No.DE-AC04-94AL85000 awarded by the U.S. Department of Energy to SandiaCorporation. The Government has certain rights to the invention.

FIELD OF THE INVENTION

The present invention relates generally to microfluidic systems and moreparticularly to structures which facilitate the introduction of fluidsinto devices having microfluidic channels.

BACKGROUND OF THE INVENTION

Microfluidic devices or substrates typically consist of two or moremicrochannels or capillaries that can range in size from about 5-100 μmwide and 5-100 μm deep etched or molded in a substrate that can besilicon, plastic, quartz, glass, or plastic. Microfluidic substrates maybe fabricated using photolithographic techniques similar to those usedin the semi-conductor industry, and the resulting devices can be used toperform a variety of sophisticated chemical and biological analyticaltechniques. Microfluidic analytical technology has a number ofadvantages, including the ability to use very small sample sizes,typically on the order of nanoliters. The substrates may be produced ata relatively low cost, and can be formatted to perform numerous specificanalytical operations, including mixing, dispensing, valving, reactions,and detections.

Another recently developed class of sample-receiving microfluidicsubstrates includes substrates having a capillary interface that allowscompounds to be brought onto the test substrate from an external source,and which can be advantageously used in a number of assay formats forhigh-throughput screening applications. These assay formats includefluorogenic assays, fluorescence polarization assays, non-fluorogenicmobility shift assays, dose response assays, and calcium flux cell-basedassays.

Other applications for microfluidic devices include diagnosticsinvolving biomolecules and other analytical techniques such as micrototal analysis systems. Such devices, often referred to in the art as“microchips,” also may be fabricated from plastic, with the channelsbeing etched, machined or injection molded into individual substrates.Multiple substrates may be suitably arranged and laminated to constructa microchip of desired function and geometry. In all cases, the channelsused to carry out the analyses typically are of capillary scaledimension.

To fully exploit the technological advances offered by the use ofmicrofluidic devices and to maintain the degree of sensitivity foranalytical techniques when processing small volumes, e.g., microlitersor less, connectors which introduce and/or withdraw fluids, i.e.,liquids and gases, from the device, as well as interconnect microfluidicdevices, are crucial components in the use and performance of themicrofluidic device. For example, chromatographic applications requirean injection port that can introduce a sample into a flow stream. Thevaried uses of these microfluidic devices require connectors that areboth versatile and resilient. The physical stresses placed on theseconnectors can be demanding. Not only must the connectors be inert toreactive substances that are injected into the microchannels, such asorganic solvents, but also they must remain leak free when exposed topressures that can reach as high as 10,000 psi. Moreover, theseconnectors must be able to act as an interface for connecting macroscaledevices such as injectors and fluid reservoirs to microscale capillarytubes. However, because of the extremely small tolerances involved thishas been difficult to achieve. Typically, capillary tubes have outerdiameters on the order of 150 to 365 μm and nominal internal diametersof from 50 to 75 μm or less with tolerances as small as a few microns,yet these capillary tubes must be accurately aligned.

A common technique used in the past involves bonding a length of tubingto a port on the microfluidic device with epoxy or other suitableadhesive. Adhesive bonding is unsuitable for many chemical analysisapplications because the solvents used attack the adhesive which canlead to channel clogging, detachment of the tubing, and/or contaminationof the sample and/or reagents in or delivered to the device.Furthermore, adhesive bonding results in a permanent attachment of thetubing to the microfluidic device which makes it difficult to changecomponents, i.e., either the microfluidic device or the tubing, ifnecessary. Thus assembly, repair and maintenance of such devices becomelabor and time intensive, a particularly undesirable feature when themicrofluidic device is used for high throughput screening of samplessuch as in drug discovery.

To avoid problems associated with adhesive bonding, other techniqueshave been proposed, e.g., press fitting the tubing into a port on themicrofluidic device. However, such a connection typically is unsuitablefor high-pressure applications such as HPLC. Additionally, pressing thetubing into a port creates high stress loads on the microfluidic devicewhich could lead to fractures of the channels and/or device.

Other methods involved introducing liquids into an open port on themicrofluidic device with the use of an external delivery system such asa pipette. However, this technique also is undesirable due to thepossibility of leaks and spills which may lead to contamination. Inaddition, the fluid is delivered discretely rather than continuously.Moreover, the use of open pipetting techniques does not permit the useof elevated pressure for fluid delivery such as delivered by a pump,thereby further restricting the applicability of the microfluidicdevice.

Microfluidic devices generally comprise an array of micron-sized wellsor reservoirs and interconnecting channels disposed on a substrate. Thewells are connected to distribution means for dispensing fluids to andcollecting fluids from the array. Connection to the wells is typicallyby means of a micropipette end. While this serves for benign addition offluids this means of fluid addition cannot be used for thoseapplications where the access ports are exposed to a pressuredifferential or where it is desired to connect capillary tubes to fluidwells.

Typically, in microscale devices the microchannels are terminated byports or wells that provide access to the microchannels. Materials areadded to the microchannels through these ports or wells. Access to theports is typically by means of a micropipette end. While this serves forbenign addition fluids it cannot be used for those applications wherethe access ports are exposed to a pressure differential or adverseenvironments.

Therefore, a need exists for an improved microfluidic connector which isuseful with all types of microfluidic devices and which provides aneffective, high pressure connector with low fluid dead volume seal. Ingeneral, the connector should be able to connect a first set ofcapillaries to a second set of capillaries. The first set can beexternal capillaries whereas the second set can be from a microfluidicdevice.

SUMMARY OF THE INVENTION

The invention is based in part on the development of an interconnectingdevice for connecting a plurality of first fluid-bearing conduits to acorresponding plurality of second fluid-bearing conduits therebyproviding fluid communication between the first fluid-bearing conduitsand the second fluid-bearing conduits. In one embodiment the connectorincludes:

a support plate;

a manifold that is positioned on the support plate and that defines aplurality of recess regions within the manifold and having a pluralityof channels wherein each channel has a first opening at a lower end ofeach recess region and a second opening at a lower surface of themanifold, wherein each of the second fluid-bearing conduits ispositioned within one of the channels so that the distal end of eachsecond fluid-bearing conduit is positioned in or near the first opening;

a ferrule plate that is positioned on the manifold and that defines aplurality of protrusions wherein each protrusion fits into acorresponding recess region of the manifold and the ferrule plate has aplurality of passages with each passage traversing the height of theferrule plate and through the protrusion and wherein each of the firstfluid-bearing conduits is positioned within one of the passages so thatthe proximal end of each first fluid-bearing conduit abuts the distalend of a corresponding second fluid-bearing conduit; and

means for applying an axial force on the ferrule plate to cause theplurality of protrusions of the ferrule plate to contact a correspondingrecess region of the manifold.

In another embodiment, the connector includes:

a support plate;

a lower ferrule plate that is positioned on the support plate and thatdefines a plurality of first protrusions;

a manifold that is positioned on the lower ferrule plate and thatdefines (i) a plurality of first recess regions within the manifold and(ii) a plurality of second recess regions within the manifold, whereineach of the first recess regions is connected to a corresponding secondrecess region;

an upper ferrule plate that is positioned on the manifold and thatdefines a plurality of second protrusions wherein each second protrusionfits into a corresponding second recess region and wherein the upperferrule plate has a plurality of second passages with each secondpassage traversing the height of the upper ferrule plate and through thesecond protrusions, and wherein each first protrusion of the firstferrule plate fits into a corresponding first recess region so that eachfirst passage of the lower ferrule plate is in communication with acorresponding second passage of the upper ferrule plate and wherein eachof the first fluid-bearing conduits is positioned within one of firstpassages and each of the second fluid-bearing conduits is positionedwithin one of the second passages so that that the proximal end of eachfirst fluid-bearing conduit abuts the distal end of a correspondingsecond fluid-bearing conduit; and

means for applying an axial force on the first and second ferrule platesto cause the plurality first protrusions to contact a correspondingfirst recess region and to cause the plurality second protrusions tocontact a corresponding second recess regions.

The connector is particularly suited for connecting two sets ofcapillaries but the connector device can also accommodate ferrules andvials. In use, the connector device can be positioned on the surface ofa microscale device so that the ports of the microscale device is influid communication with the connector.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a disassembled capillary interconnectdevice;

FIG. 2 is a top view of the device as assembled;

FIG. 3 is a cross-sectional view of the device as assembled;

FIG. 4 is an enlarged view of portion B of the device from FIG. 3.

FIG. 5 is a perspective view of a second disassembled capillary tomicrofluidic interconnect device;

FIG. 6 is a top view of the device as assembled;

FIG. 7 is a cross-sectional view of the assembled device shownpositioned on a substrate;

FIG. 8 is an enlarged view of portion A of the device from FIG. 7;

FIGS. 9-11 illustrate a one-piece ferrule.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The invention is directed to techniques for connecting two sets ofcapillaries together and for connecting capillaries and/or other fluidconduits directly to inlet and/or outlet ports of a microscale device.For convenience, one set will be referred to as the “inlet” capillariesand the other set as the “outlet” capillaries. It is not intended thatthe structures and dimensions of the inlet and outlet capillaries bedifferent. Preferred capillaries have circular inner diameters thatrange from 5 microns to 250 microns. Capillaries are availablecommercially from numerous sources including, for example, PolymicroTechnologies LLC (Phoenix, Ariz.).

The inventive interconnecting device is particularly suited forconnecting inlet capillaries to outlet capillaries that are in turnconnected to a microfluidic substrate or device. The outlet capillaries,for example, may be connected to sources of chemicals, solvents andother fluids that are delivered to and used in the microfluidic device.Alternatively, some or all of the outlet capillaries may be connected towaste containers, other microfluidic devices, and/or other externalbodies where fluids are sent.

The interconnect device is particularly suited for high pressureoperations where the internal, i.e., liquid fluid, pressures within thecapillaries are at least 500 psi. It has been demonstrated that theinventive interconnect device will withstand pressures of up to at least5,000 psi.

FIGS. 1-4 illustrate one embodiment of the capillary interconnectdevice. As depicted in FIG. 1, the device 50 includes (i) a lowerinterconnect stiffening or support plate 62; (ii) lower ferrule plate70; (iii) manifold 68; (iv) upper ferrule plate 86; and (v) topinterconnect plate 80. The support plate 62 and top interconnect plate80 ensure uniform sealing of device 50 as described further herein.Support plate 62 is provided with threaded wells 52 at both ends thatreceive screws 82 that hold the various parts of the capillaryinterconnect device 50 in proper orientation and fasten the parts of thedevice together. Support plate 62 has a linear array of apertures 56through which capillaries 90 are inserted as described further herein.Both support plate 62 and top interconnect plate 80 are preferably madeof a stiff material such as metal, e.g., stainless steel, or highstrength ceramics.

Manifold 68 also has a linear array of orifices 72 that traverse theheight of the manifold 68. As further shown in FIGS. 3 and 4, eachorifice defines an upper recess region 94 and a lower recess region 96.The recess regions preferably are cavities with conical-shaped exteriorsurfaces, however, the cavities can have any external shape. The onlylimitation being that the contour of each interior surface substantiallymatches that of the exterior surface of the protrusions of the top andlower ferrule plates as described herein. As depicted in FIG. 4, thediameter of the recess regions 94, 96 at their narrow ends are slightlyless than the corresponding initial diameters of the protrusions 74, 76.This angle difference allows compressive forces to be applied onto thetip of each capillary. In a preferred embodiment, the inner surfaces ofthe recess regions 94, 96 define conical-shaped cavities suitablycontoured to receive corresponding conical-shaped protrusions 74 ofupper ferrule plate 86 and protrusions 76 of and lower ferrule plate 70,respectively. As shown in FIG. 4, recess regions 94, 96 are connected bya narrow gap 98. The height of the gap preferably ranges from 50 μm to150 μm. Manifold 68 is preferably made of a rigid polymer material suchas polyetherimide (PEI) that is that sold under the tradename ULTEM byGeneral Electric Co., polyether ether ketone, and acetal (e.g., DELRIN).

As shown in FIGS. 1, 3, and 4, upper ferrule plate 86, which mates withmanifold 68, also has a linear array of apertures 78 on its uppersurface with each aperture defining a passage which traverses the heightof the upper ferrule plate. (A capillary 92 is positioned in eachpassage.) The upper ferrule plate 86 has an underside with an array ofconical-shaped protrusions 74 projecting from the underside such thateach passage (shown in FIG. 4 as being occupied by capillary 92)terminates at the end of a conical-shaped protrusion 74.

The lower ferrule plate 70 is essentially identical to the upper ferruleplate 86 but its positioned is reversed. As shown in FIGS. 1, 3, and 4lower ferrule plate 70, which mates with manifold 68, has a linear arrayof apertures on its lower surface with each aperture defining a passagewhich traverses the height of the lower ferrule plate 70. (A capillary90 is positioned in each passage.) The lower ferrule plate 70 has antopside with an array of conical-shaped protrusions 76 projectingtherefrom such that each passage terminates at the end of aconical-shaped protrusion 76. It is preferred that the upper and lowerferrule plates 86, 70 be made of material that is both deformable undermechanical compression and that is easy to machine or mold.

While this embodiment of the connector device has been illustrated usinginlet and outlet capillaries without ferrules, the capillaries can alsobe attached preferably using one-piece ferrules. Furthermore, vials canalso be employed and the connector device can be attached directly to amicroscale device as further described herein.

Mechanical compression is applied to upper and lower ferrule plates 86,70 by means of a rigid, top interconnect plate 80 which has an array ofholes 84 which are aligned to the array of apertures of the upper andlower ferrule plates 86, 70. Threaded walls 81 are drilled through theinterconnect to provide passage for screws 82 that serve to exertmechanical compression on the assembly.

In operation, to connect a set of inlet capillaries 90 to acorresponding set of outlet capillaries 92, the distal ends of theinternal capillaries are inserted through the passages of the lowerferrule plate 70 and the channels of the manifold 68 until the tips ofthe capillaries reach the lower portion of gap 98. Similarly, a set ofoutlet capillaries are inserted through the holes 84 of the topinterconnect plate and through the passage of the upper ferrule plate 86until their tips reach the upper portion of gap 98. In this fashion,each outlet capillary is aligned with a corresponding inlet capillary.

The screws 82 are then tightened to assemble the interconnect device. Ascompressive forces are applied, the conical shaped protrusions of theupper ferrule plate 86, which are preferably made of a chemically inertmaterial that readily deforms under mechanical compression, are insertedinto the mating cavities or channels 72 of manifold 68. As a result, thebottom surface of each conical shaped body deforms around the outersurface of each capillary thereby supporting and securing the outletcapillary. Deformation of the conical shaped bodies also provides afluid tight seal. Similarly, the conical shaped bodies of the lowerferrule plate 70, which are also preferably made of a chemically inertmaterial that readily deforms under mechanical compression, are insertedinto the mating cavities or channels of manifold 68. High pressurefluids can now flow through the two sets of capillaries.

The capillary interconnect device can also be employed to connectexternal capillaries and/or other fluid conduits directly to the inletand/or outlet ports of a microscale device as illustrated in FIGS. 5-8.As depicted in FIG. 5, the device 10 includes (i) a lower interconnectstiffening or support plate 12; (ii) manifold 18; (iii) ferrule plate24; and (iv) top interconnect plate 30. The support plate 12 and topinterconnect plate 30 ensure uniform sealing of device 10 as describedfurther herein. Support plate 12 is provided with threaded wells 36 atboth ends that receive screws 32 that hold the various parts of thecapillary interconnect device 10 in proper orientation and that fastenthe parts of the device together. Support plate 12 has an internalcavity or slot 16 that acts as a receptacle for a lower portion 20 ofmanifold 18. Both support plate 12 and top interconnect plate 30 arepreferably made of metal, e.g., stainless steel, or high strengthceramics.

As further shown in FIGS. 7 and 8, the lower portion 20 of manifold 18fits into slot 16 of support plate 12 so that the lower planar surfaceof manifold 18 rests on the surface of substrate 14, e.g., microfluidicchip. The substrate 14 includes a number of fluid channels 15 with inletand/or outlet ports on the substrate surface. The manifold 18 ispreferably made of a polymer material that is rigid and that will adhereto glass which is the material of many conventional microscale devices.A preferred material is a polyetherimide that is that sold under thetradename ULTEM by General Electric Co. Preferably manifold 18 is bondedto substrate 14 with a suitable adhesive.

As shown in FIGS. 5 and 8, the top surface of manifold 18 has a lineararray of with recess regions 22 which are preferably cavities withconical-shaped, i.e. tapered, exterior surfaces 46. It is understoodthat the cavities can have any shape, the only limitation being that thecontour of each inner surface 48 substantially matches that of theexterior surfaces 46 of the protrusions from the ferrule plate asdescribed herein. Preferably the two surface angles are not the same topermit enhanced deformation at the tip of the ferrule plate protrusions.As further shown in FIGS. 7 and 8, each conical-shaped cavity 22 isconnected to channel sections 42,44 that runs to the bottom surface themanifold. In this case, the diameter of the upper portion 44 of thechannel is slightly larger than the remaining lower section 42.

As shown in FIGS. 5, 7, and 8, ferrule plate 24, which mates withmanifold 18, also has a linear array of apertures 28 on its uppersurface with each aperture defining passages 40 which traverses theheight of the ferrule plate 24. The ferrule plate 24 has an undersidewith an array of conical shaped protrusions 26 projecting from theunderside such that each passage 40 terminates at the end of aprotrusion 26. It is preferred that the ferrule plate 24 be made ofmaterial that is both deformable under mechanical compression and thatis easy to machine or mold. Suitable materials include, for example,polyether ether ketone, high density polyethylene, or polyamide. Apreferred material is a solid, abrasion resistant, self-lubricating,polyamide available under the trade name VESPEL from Du PontCorporation.

Mechanical compression is applied to ferrule plate 24 by means of arigid, top interconnect plate 30 which has an array of holes 34 that arealigned to apertures 28 of ferrule plate 24. Threaded walls 31 aredrilled through the interconnect plate to provide passage for screws 32that serve to exert mechanical compression on the assembly.

As illustrated in FIG. 7, the interconnect device 10 can be employed todeliver and/or remove fluids from a microscale device 14. The device 10as assembled is preferably attached with adhesive on the upper surfaceof the microscale device 14 which has inlet and outlet ports that areconnected to internal channels 15. The dimensions and spacings of theports match those of passages 42 such that the lower surface of device10 can be attached, e.g., bonded with epoxy, directly onto the uppersurface of the microscale device so that each passage 42 of device 10will be aligned with an inlet and/or outlet port of channel 15 ofmicroscale device 10. In this fashion, no internal capillary is neededto connect device 10 to microscale device 14, that is, passages 42 arein direct fluid communication with channels 15. Capillary 91 is depictedas being positioned within one of the passages 42.

In operation, in one embodiment, a set of external capillaries areconnected by inserting their proximal ends through holes 34 of the topinterconnect plate 30 and through apertures 28 of the ferrule plate 24until their tips bottom out at the upper channel section 44 of themanifold. In this fashion, each external capillary serves as a source offluid to the microscale device or as a conduit through which fluid isremoved from the microscale device. As the screws 32 are tightened andthe compressive forces applied as shown in FIG. 5, the conical-shapedprotrusions 26 of ferrule plate 24, which are preferably made of achemically inert material that readily deforms under mechanicalcompression, are inserted into the mating conical-shaped cavities 22 ofmanifold 18. As a result, as shown in FIG. 8, the bottom surface 46 ofeach conical-shaped protrusion deforms around the outer surface 48 ofthe conical-shaped cavities. Deformation of the conical-shapedprotrusions also provides a fluid tight seal around the capillary to themicroscale device.

FIGS. 10 and 11 also depict the threaded, one piece ferrule. The ferruleincludes an adapter body 112 having an hexagonal nut 114 on one side andan elongated member 110,118 on the other side. End portion 118 of theelongated member is tapered. The ferrule has internal bore 120,122 thatruns the length of the ferrule from inlet 128 to outlet 116. Preferably,as shown in FIG. 11, the proximal portion 122 of the bore is broader tofacilitate insertion of a capillary tube into the wider distal portion120 of the bore. The wall of the bore at the tapered end will collapsedirectly against the tube as compressive forces are created as theferrule is screwed into the threaded conical-shaped cavity. Thiseffectively prevents the capillary tube from extruding during highpressure operations.

Each ferrule is machined from a block of material to fabricate a single,integral piece ferrule. The bore is formed using conventional drills andthreads are machined preferably on the exterior of the non-taper portion110 of the elongated member. When using the ferrule, no flange isneeded. In addition, a mating sleeve is not needed since the bore willcollapse against the tube under compressive force. By “mating sleeve” ismeant an extra tube that is inserted into the bore of the ferrule beforethe capillary tube that will be transferring a fluid of interest isinserted through the bore of the mating sleeve. Mating sleeves having anouter diameter that matches the inner diameter of prior art ferrules areused quite often but are not needed with the inventive ferrule.Machining permits exact tolerance to be maintained to improve fittingsfunction. Because the ferrules are fabricated by machining, that is,they are not made by molding, a wide range of materials, includingplastics, ceramics, and metals, for example, can be used depending onthe expected operating conditions, e.g., temperature, pressure, and typeof fluids the ferrule will be exposed to. The ferrules are reusable andcan be finger-tightened to provide a seal that can withstand a minimumpressure of 5,000 psi.

The ferrule is particularly suited for high pressure operations toconnect capillary tubes in microfluidic applications and therefore theferrule is dimensioned accordingly. In this regard, referring to theferrule shown in FIG. 11, the diameter of the distal portion 120 of thebore is preferably 0.0145 in. (0.368 mm) to 0.015 in. (0.38 mm) and thediameter of the proximal portion 122 of the bore is typically 0.018 in.(0.46 mm) to 0.020 in. (0.51 mm).

While the embodiments illustrated shows a plurality of capillaryinterconnections oriented linearly the device can be used for a singlecapillary interconnection and could be equally effective in a circularorientation to interconnect capillary bundles. Moreover, theinterconnect device can be used to connect at least two substratestogether.

The reusable interconnecting device can be employed to provide fluidtype communication between two sets of capillaries regardless of whatthe capillaries are ultimately connected. Typically, at least one ormore of the capillaries from one set will be connected to a substratewhich refers to any microfluidic device that has an integrated networkof microfluidic channels disposed therein. The particular design orconfiguration of the internal structure of the substrate is notcritical. Such substrates are also referred as microfluidic ormicroscale wafers or chips.

The substrate include microfluidic channels, e.g., sealed enclosedgroove, depression, and tube, which is adapted to handle small volumesof fluid. Typically, the channel is a tube, channel or conduit having atleast one subsection with at least one cross-sectional dimension ofbetween about 0.1 microns and 500 microns, and typically less than 100microns.

The substrate is preferably fabricated from glass, quartz, silicon orplastic by conventional techniques including LIGA (an acronym for theGerman for lithography, electroplating, and molding), deep x-raylithography, silicon surface micromachining and lithography, electricdischarge machining, and direct laser additive fabrication. In addition,commercially available substrates can be modified with appropriatedimensioned inlet and/or outlet ports as further described herein. Thesubstrate may include reaction cells, reservoirs, and other structuresthat are interconnected by a network of microchannels and a series ofmicropumps. Such substrates are further described in U.S. Pat. No.5,846,396 to Zanzucchi, et al. which is incorporated herein.

Conventional mechanical pumps can be employed to transport liquid fluidsthrough the capillaries although a preferred method employs a highpressure hydraulic system that has no moving parts for convertingelectric potential to hydraulic force and for manipulating fluids whichare described in U.S. Pat. Nos. 6,013,164 to Paul, et al., 6,019,882 toPaul, et al., 6,224,728 to Obomy, et al., and 6,277,257 to Paul, et al.,and 6,290,909 to Paul, et al., which are incorporated herein byreference.

Although only preferred embodiments of the invention are specificallydisclosed and described above, it will be appreciated that manymodifications and variations of the present invention are possible inlight of the above teachings and within the purview of the appendedclaims without departing from the spirit and intended scope of theinvention.

1. A connector assembly that provides fluid communication between firstfluid-bearing conduits and second fluid-bearing conduits that comprises:a plurality of first fluid-bearing conduits; a corresponding pluralityof second fluid-bearing conduits; a support plate; a manifold that ispositioned on the support plate and that defines a plurality of recessregions within the manifold and having a plurality of channels whereineach channel has a first opening at a lower end of each recess regionand a second opening at a lower surface of the manifold, wherein each ofthe second fluid-bearing conduits is positioned within one of thechannels so that the distal end of each second fluid-bearing conduit ispositioned in or near the first opening wherein the manifold is made ofa rigid material; a ferrule plate that is positioned on the manifold andthat defines a plurality of protrusions wherein each protrusion fitsinto a corresponding recess region of the manifold and the ferrule platehas a plurality of passages with each passage traversing the height ofthe ferrule plate and through the protrusion and wherein each of thefirst fluid-bearing conduits is positioned within one of the passages sothat a proximal end of each first fluid-bearing conduit abuts a distalend of a corresponding second fluid-bearing conduit wherein theprotrusions are made of a compliant material and wherein each recessregion of the manifold has a cavity structure with a conical-shapedexterior surface and each protrusion of the ferrule plate has acorresponding conical-shaped exterior surface; and means for applying anaxial force on the ferrule plate to case the plurality of protrusions ofthe ferrule plate to contact a corresponding recess region of themanifold.
 2. The connector assembly of claim 1 wherein the means forapplying the axial force is selected from the group consisting of ascrew, cam and clamp and each of the support plate, manifold, andferrule plate is threaded to accept the screw.
 3. The connector assemblyof claim 1 further comprising a top interconnect plate that ispositioned on the ferrule plate wherein the means for applying an axialforce engages the top interconnect plate to cause the axial force to bedistributed evenly along the length of the ferrule plate.
 4. Theconnector assembly of claim 1 wherein the top interconnect plate has aplurality of holes through which the plurality of first fluid-bearingconduits are inserted.
 5. The connector assembly of claim 1 wherein thesecond fluid-bearing conduits are channels within a substrate whereinthe channels have ports on the surface of the substrate and a lowersurface of the support plate is positioned on said surface of thesubstrate.
 6. The connector assembly of claim 5 wherein the supportplate defines a slot through which a lower portion of the manifold ispositioned and a lower surface of said lower portion of the manifold isattached to the substrate surface.
 7. The connector assembly of claim 5wherein the substrate is a microfluidic device.
 8. The connectorassembly of claim 1 wherein each of the first and second fluid-bearingconduits comprise a capillary tube with an inner diameter that rangesfrom 5 microns to 250 microns.
 9. The connector assembly of claim 1wherein at least one of the first fluid-bearing conduits comprises avial.
 10. The connector assembly of claim 1 wherein the plurality offirst fluid-bearing conduits are arranged in a linear array along thelength of the manifold.
 11. The connector assembly of claim 1 whereinthe plurality of first fluid-bearing conduits are arranged in a circularorientation.
 12. The connector assembly of claim 1 wherein the means forapplying the axial force causes the proximal end of the firstfluid-bearing conduits to come into contact with the distal end of thecorresponding second fluid-bearing conduits.
 13. A connector assemblythat provides fluid communication between first fluid-bearing conduitsand second fluid-bearing conduits that comprises: a plurality of firstfluid-bearing conduits; a corresponding plurality of secondfluid-bearing conduits; a support plate; a lower ferrule plate that ispositioned on the support plate and that defines a plurality of firstprotrusions; a manifold that is positioned on the lower ferrule plateand that defines (i) a plurality of first recess regions within themanifold and (ii) a plurality of second recess regions within themanifold, wherein each of the first recess regions is connected to acorresponding second recess region; an upper ferrule plate that ispositioned on the manifold and that defines a plurality of secondprotrusions wherein each second protrusion fits into a correspondingsecond recess region and wherein the upper ferrule plate has a pluralityof second passages with each second passage traversing the height of theupper ferrule plate and through the second protrusions, and wherein eachfirst protrusion of the first ferrule plate fits into a correspondingfirst recess region so that each first passage of the lower ferruleplate is in communication with a corresponding second passage of theupper ferrule plate and wherein each of the first fluid-bearing conduitsis positioned within one of first passages and each of the secondfluid-bearing conduits is positioned within one of the second passagesso that that a proximal end of each first fluid-bearing conduit abuts adistal end of a corresponding second fluid-bearing conduit; and meansfor applying an axial force on the first and second ferrule plates tocause the plurality first protrusions to contact a corresponding firstrecess region and to cause the plurality second protrusions to contact acorresponding second recess regions.
 14. The connector assembly of claim13 wherein each of the first recess regions is connected tocorresponding second recess regions by channel within the manifold. 15.The connector assembly of claim 14 wherein the proximal end of eachfirst fluid-bearing conduit and the distal end of a corresponding secondfluid-bearing conduit is positioned within a channel of the manifold.16. The connector assembly of claim 14 wherein each first recess regionof the manifold has a first cavity structure with a conical-shapedexterior surface and each first protrusion of the first ferrule platehas a corresponding exterior surface with a contour that matches theconical-shaped exterior surface of the first cavity structure andwherein each second recess region of the manifold has a second cavitystructure with a conical-shaped exterior surface and each secondprotrusion of the second ferrule plate has a corresponding exteriorsurface with a contour that matches the conical-shaped exterior surfaceof the second cavity structure.
 17. The connector assembly of claim 13wherein the means for applying the axial force comprises at least onescrew and each of the support plate, manifold, and first and secondferrules is threaded to accept the screw.
 18. The connector assembly ofclaim 13 wherein the first and second protrusions are made of acompliant material.
 19. The connector assembly of claim 13 furthercomprising a top interconnect plate that is positioned on the upperferrule plate wherein the means for applying an axial force engages thetop interconnect plate to cause the axial force to be distributed evenlyalong the lengths of the upper and lower ferrule plates.
 20. Theconnector assembly of claim 13 wherein the support plate comprises aplurality of holes through which the second fluid-bearing conduits areinserted.
 21. The connector assembly of claim 19 wherein the secondfluid-bearing conduits emanate from a substrate and a lower surface ofthe support plate is attached to a substrate surface.
 22. The connectorassembly of claim 21 wherein the substrate is a microfluidic device. 23.The connector assembly of claim 13 wherein at least one of the firstfluid-bearing conduits comprises a vial.
 24. The connector assembly ofclaim 13 wherein each of the first and second fluid-bearing conduitscomprises a capillary tube with an inner diameter that ranges from 5microns to 250 microns.
 25. The connector assembly of claim 13 whereinthe plurality of first fluid-bearing conduits are arranged in a lineararray along the length of the manifold.
 26. The connector assembly ofclaim 13 wherein the plurality of first fluid-bearing conduits arearranged in a circular array.